LATEST ANNOUNCEMENTS

The registration system is now open. Please click HERE for registration instructions.

Due to the unforeseen circumstances, the conference will be held in Wuxi, China. Please note that the dates will remain unchanged. The details will be announced shortly.

Click HERE to download the Advanced Program.

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2025) is organized by Jiangsu Integrated Circuit Application Technology Innovation Center and City University of Hong Kong (CityUHK) Qingdao Innovation Centre, and co-organized by Wuxi Industrial Innovation Research Institute (WIIRI), Ceyear Technologies Co. Ltd, City University of Hong Kong, Nanjing University of Aeronautics and Astronautics (NUAA), National University of Singapore (Suzhou) Research Institute, the 55th Research Institute of China Electronics Technology Group Corporation (CETC55) and National Key Laboratory of Solid-State Microwave Devices and Circuits. IMWS-AMP 2025 is a continuation of a series of annual international events held in Suzhou, China (2015), Chengdu, China (2016), Pavia, Italy (2017), Michigan, USA (2018), Bochum, Germany (2019), Suzhou, China (2020), Chongqing, China (2021), Guangzhou, China (2022), Chengdu, China (2023), and Nanjing, China (2024). The purpose of this platform is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community.

IMWS-AMP 2025 will be held in QingdaoWuxi, China on July 23-26, 2025. IMWS-AMP 2025 will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology trends and significant advances in relevant topics. Contributed papers are solicited for the same topics as listed below.

Topics:
The topics include, but are not limited to, the following technical areas:
• Carbon nanotubes and 2D electronic and optoelectronic devices (e.g. graphene and beyond graphene)
• Wide bandgap and other emerging semiconductor materials (e.g. ionic materials) based electronic devices: characterization, modelling and design
• Advanced silicon, integrated passive devices and through substrate via
• Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices
• Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications
• Fan-out wafer/panel level packaging for 5G mmWave and IoT, etc.
• Flexible materials for RF electronics and antennas
• Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation
• Ferromagnetic materials and superconducting materials
• Spin-wave and magnetic crystal materials
• Passive/active microwave and terahertz devices (material characterization, fabrications, and applications)
• Antennas with advanced/complex/artificial materials and processes

Important Dates:

Paper Submission Deadline:  Mar 24, 2025   Apr 7, 2025

Notification of Acceptance: Apr 28, 2025

Final paper Submission: May 19, 2025

Conference Venue:

Wuxi, China

For any queries, please contact us at info@imws-amp.org.